PFAS in Occupational Settings Beyond Firefighting: Chemical Workers, Semiconductor Fab Operators, and Airport Ground Crews

PFAS Occupational Exposure: The Broader Workforce Picture

Firefighters’ PFAS occupational exposure has received substantial media and regulatory attention—but they represent only a fraction of workers with elevated occupational PFAS exposure. Chemical production workers at fluorochemical manufacturing facilities, semiconductor fab cleanroom operators, airport ground crews maintaining AFFF systems, textile mill finishing workers, and chrome plating facility workers all face documented occupational PFAS exposures that significantly exceed general population levels. Occupational PFAS biomonitoring—measuring PFAS in workers’ blood serum—provides some of the highest concentration data in human populations and informs risk assessments that underpin regulatory decisions affecting the general public.

Fluorochemical Production Workers: The Highest Exposures Documented

Workers at 3M’s Decatur, Alabama facility (which manufactured PFOS until 2002) and DuPont’s Washington Works in Parkersburg, West Virginia (PFOA production) were among the first populations studied for PFAS occupational health effects. Historical blood PFOS in 3M Decatur production workers exceeded 2,000 ng/mL—500 times the contemporary US general population median. A landmark study by Gilliland and Mandel in 1993 found elevated cholesterol levels in 3M production workers—among the first human epidemiological evidence for PFAS health effects. Subsequent studies at the Decatur plant found elevated incidence of bladder cancer and other malignancies. Current fluorochemical production workers at Chinese facilities (Jiangsu Anpon, Shandong Dongyue) and European plants (Chemours Rotterdam, Solvay Belgium) show blood PFAS concentrations 10–100 times higher than adjacent community populations—confirming ongoing significant occupational exposure despite reduced PFOS/PFOA production.

Semiconductor Cleanroom Workers: Fluorinated Solvent Exposure

Semiconductor fab cleanroom workers are exposed to PFAS through multiple pathways: PFAS photoresist components used in lithography processes; fluorinated etch gases (NF3, SF6, CF4) that generate PFAS transformation products; hydrofluoroether solvents used for photomask cleaning; and PFAS-treated cleanroom suit materials. Biomonitoring of semiconductor fab workers in Taiwan (TSMC, ASE facilities) and South Korea (Samsung, SK Hynix) shows blood PFAS concentrations 2–5 times higher than non-fab workers in the same communities—a pattern consistent with occupational PFAS exposure. OSHA in the US and occupational safety agencies in Taiwan and South Korea are beginning to characterize semiconductor fab PFAS exposures more systematically, but occupational exposure limits for PFAS in fab environments do not yet exist in any jurisdiction.

Airport Ground Crews and AFFF Maintenance Workers

Airport ground crew workers who maintain AFFF systems, respond to fuel spills, or work in proximity to AFFF vehicle systems face dermal and inhalation PFAS exposure. A 2020 Australian study of airport ARFF (Airport Rescue and Fire Fighting) personnel found blood PFAS concentrations 3–8 times higher than airport office workers—with former AFFF system maintenance workers showing the highest concentrations. US studies of airport ARFF workers at Logan, O’Hare, and LAX show similar elevation patterns. Transition to fluorine-free foam systems will significantly reduce ongoing occupational exposure for airport emergency responders, but workers with long AFFF service histories carry elevated PFAS body burdens accumulated over decades of exposure that will persist for years to decades after exposure ceases.

The full scope of occupational PFAS exposure across industrial and service sectors remains incompletely characterized—and comprehensive occupational exposure monitoring programs are needed to protect workers in high-exposure settings while contributing to the broader evidence base for PFAS health risk assessment.

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